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Nanofabrication Facility
 Sputtering System - 3 target
CNS ID: SP-3
MakeAJA
ModelOrion 3
CategoryPhysical Vapor Deposition
NameSputtering System - 3 target
LocationLISE - Cleanroom G07
 
 
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More Info
The SP-3 has a turbo-pumped chamber that reaches a vacuum in the 10-7 Torr range with a pump-down time of ~1 hour. Three shuttered magnetron guns each contain 2" diameter targets. Two DC guns for deposition of conductive materials and one RF gun for deposition of conductive or non-conductive materials. Argon flow and chamber pressure control for optimizing deposition conditions. O2 mass flow controlled process gas for reactive sputtering. Heated rotating substrate holder that maintains temperature control up to 800C for manipulation of film crystal structure, and accommodates substrates up to 4" in diameter.

Applications: Sputter deposition of metal, semiconductor, and/or dielectric thin films onto pieces of substrates or whole substrates up to 4" diameter. The SP-3's configuration affords good sidewall coverage of features for insulation/isolation. Depositions can be single thin films or multilayered with up to three different films in one pump-down. Shuttered magnetron guns maintain sharp interfaces between thin films.
Comments
Some Targets Available for Use: Ag, Al, Cr, Cu, Ge, Mo, Nb, Pd, Si, Ti, Al2O3, ITO, SiO2, TiO2, ZnO
 
Contact Info:
Ed Macomber
LISE G44
11 Oxford Street
Cambridge, MA 02138
617-384-5227
eddiemaccns.fas.harvard.edu
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu
 
 

10/06/14
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