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CNS User Info
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» Training Sign-up
   
   
   
   
CNS Training Events - Registration Page
 

Registration is currently open for the following training sessions:

select month:
Monday, January 26th, 2015
Training - Denton e-beam evaporator (EE-4) - LISE G07 (cleanroom); PVD Bay
Trainer: Ed Macomber
Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Ge, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  1:00 pm - 2:00 pm
(check links in confirmation email for documents)
4 FULL Registration Closed  
 
Training - Disco ADA-321 Automatic Dicing Saw Training Part 1-Basic Operation - LISE G06
Trainer: Jason Tresback
This training event will cover the basic operation of the Disco ADA-321 Automatic Dicing Saw (SW-1). The tool uses a rotating, ultra-thin (100-300 um Thick) diamond/resin composite blade, in a wet environment to cut materials such as silicon wafers, non-toxic semiconductors, glass sheets, quartz, sapphire, ceramics, etc. Your sample should be coating with a protective layer, such as photo resist to protect it from cutting water. Full tool access will require attending part 1-Basic operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a user qualification on another day, AND completion of the LISE G06 Room Safety Training event. Please register for each event.
  Time Max Attendees Available CNS Users ONLY
  3:30 pm - 4:30 pm
4 1 Register!  
 
Training - Electrical Characterization- Van der Pauw Resistivity and Hall Measurement System (MET-5) - LISE G27
Trainer: Jason Tresback
This training event will cover a basic introduction to electrical property measurements of semiconducting materials at CNS. Sample sizes up to 20x20 mm, containing highly ohmic contact electrodes that form a square with 5-20 mm center to center spacing are recommended for using this Hall measurement system. Room temperature operation of the Van der Pauw resistivity and Hall measurement system (MET-5) will be demonstrated and contact electrode recommendations will be discussed. Temperature dependent measurements in the range of 100K to 700K can only be made by staff assisted use. Email (jtresback@cns.fas.harvard.edu) if you have any questions, and we meet in the hallway outside LISE G27.
  Time Max Attendees Available CNS Users ONLY
  1:30 pm - 2:30 pm
3 2 Register!  
 
Training - FESEM training part 2 (Prerequisite SEM training part 1) - B20B
Trainer: Dave Lange
Basic training to use the Ultra and Supra FESEMs.
  Time Max Attendees Available CNS Users ONLY
  1:00 pm - 5:00 pm
4 FULL Registration Closed  
 
Training - FIB-4 FEI Helios 660 Part 2 Training - LISE B15F
Trainer: Andrew Magyar
Hands-on training for the FEI Helios 660. For users with no prior FIB experience. Requires Part 1 Training
  Time Max Attendees Available CNS Users ONLY
  2:00 pm - 4:00 pm
4 3 Register!  
 
Training - HAR-050 Sputter Coater Training -
Trainer: Andrew Magyar
Learn to use the sputter coater in the imaging sample prep room. This tool is primarily used to coat samples with thin (10s of nanometers) films of metals like gold or platinum/palladium to make the samples conductive for SEM.
  Time Max Attendees Available CNS Users ONLY
  10:00 am - 10:30 am
B15A Safety training required - offered immediately following the sputter coater training.
4 FULL Registration Closed  
 
Training - LISE B15A Imaging Sample Prep Room Safety Training - LISE B15A
Trainer: Andrew Magyar
This safety training is required to enter the sample prep room. A brief overview of the tools available in B15A will also be provided.
  Time Max Attendees Available CNS Users ONLY
  10:30 am - 11:00 am
8 3 Register!  
 
Training - Oxygen Plasma Stripper (RIE-5 and RIE-9) - LISE-G07, in the cleanroom Metrology bay
Trainer: Jiangdong Deng
this training will go through the basic operation procedures of two O2 plasma Strippers (RIE-5-Technics Plasma Stripper, RIE-9-Anatech Barrel Plasma system) in the cleanroom. Some typical plasma processes will be covered.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  3:30 pm - 4:00 pm
jdeng@cns.fas.harvard.edu
4 3 Register!  
 
Training - SMCR training - G07
Trainer: Hao-Yu (Greg) Lin
Maximilian Eggersdorfer at eggersdorfer@seas.harvard.edu
Mathieu Gonidec at mgonidec@gmwgroup.harvard.edu
  Time Max Attendees Available CNS Users ONLY
  12:00 pm - 1:00 pm
Please contact Maximilian Eggersdorfer at eggersdorfer@seas.harvard.edu
4 2 Register!  
 
         
 
Tuesday, January 27th, 2015
Training - Cambridge Nanotech Atomic Layer Deposition Training - Gowning area - G-07 Cleanroom (Meet in GOWNING AREA)
Trainer: Mac Hathaway
Training on the ALD oxide system

For Metals and Nitrides, you will need to use the Gemstar - ALD-2
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:30 am - 11:30 am
4 2 Register!  
 
Training - CVD - 2 Nexx PECVD System - Dry Processing Bay - LISE Cleanroom
Trainer: Philippe de Rouffignac
NEXX CVD-2 is an ECR (electron cyclotron resonance) plasma-enhanced CVD system. ECR technology produces high plasma density and low ion energy at low chamber pressure, allowing the deposition of high-quality films at relatively low temperature. The system is integrated with a load-lock wafer transfer, allowing fast system pump-down and low base pressure (10-6 to 10-7 Torr). Backside helium cooled chuck allows substrate temperature to be controlled in < 120 ºC range. The entire system is fully computer controlled. Available gases are He, Ar, N2, O2, 3% SiH4 and Ar. Films that can be deposited include SiO2, SiN4 and a-Si thin films.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  2:30 pm - 4:00 pm
Established SiO2, Si3N4, low-stress Si3N4, and amorphous Si film deposition conditions and results are listed in the Nexx PECVD Logbook.
3 3 Register!  
 
Training - CVD-3 STS PECVD - cleanroom, dry-processing bay
Trainer: Philippe de Rouffignac
The STS PECVD system utilizes two RF power supplies (LF and HF) to produce a medium density plasma that produces silicon based films depending on the process gases. The system has optimized recipes for SiO2 (at 190 and 300C), Si3N4 (at 190 and 300C), SiON, and a:Si (doped P, B and undoped).
  Time Max Attendees Available LISE Cleanroom Users ONLY
  1:30 pm - 2:30 pm
4 3 Register!  
 
Training - LISE/CNS Safety Training - LISE 311
Trainer: Jim Reynolds
This training is required as part of the CNS/NNIN User Program enrollment process. All enrolling users must take this training. The only exception is for Remote Only Users. This training can be taken prior to turning in enrollment paperwork. Please note that you WILL NOT receive a confirmation email, but if you hit the submit button your registration will be received.
  Time Max Attendees Available Open Event!
  9:30 am - 12:00 pm
9:30 am - 12:00 pm. For a map and driving directions to the LISE Building, please see the URL: http://www.cns.fas.harvard.edu/contact/index.php
15 8 Register!  
 
Training - LPCVD and APCVD Training - Dry-Processing Bay
Trainer: Philippe de Rouffignac
Training for all 6 furnaces of the Tystar System
(SiNx, Poly, TEOS, Oxidation, non-metal anneal, metal anneal) CVD 5,6,7,9,10,11
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:00 am - 11:30 am
4 3 Register!  
 
Training - Witec confocal Raman Microscope - LISE-G12
Trainer: Jiangdong Deng
This training course will go through the basic operation procedures of WITEC confocal Raman Microscope. User is welcome to bring sample for measurement. This training is required for further advance training on Witec system, such as AFM, NSOM, TERS, SEARs et al.
  Time Max Attendees Available CNS Users ONLY
  2:00 pm - 4:00 pm
4 3 Register!  
 
         
 
Wednesday, January 28th, 2015
Training - Advance SPM techniques on Asylum AFM - LISE-G12
Trainer: Jiangdong Deng
Based on users' real measurement request, this training course will cover the advanced SPM techniques beyond the AFM basic imaging on Asylum-AFM systems, including MFM, EFM, SPM-lithography, Nano-mechanical measurement, Nano-indentation, various measurement environment, et al. Before taking this training, user is required to pass the basic Asylum training first.
  Time Max Attendees Available CNS Users ONLY
  1:30 pm - 4:30 pm
2 FULL Registration Closed  
 
Training - AJA SP-2 sputtering system training - 1pm: LISE 3rd floor (room 311); LISE G07 after that (CNS Cleanroom)
Trainer: Ed Macomber
The SP-2 system is a 6-gun magnetron sputtering machine with (3) RF guns and (3) DC guns to cover a range of metals, semi-conductors, and dielectric materials, including Au, Pt, and magnetics. Sputtering materials are loaded into the system weekly on an "as-requested" basis. Substrate pre-cleaning, heating, co-sputtering, and reactive sputtering are all available on this system. We meet for classroom discussion first, then we go in the cleanroom for training on the actual system.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  1:00 pm - 4:00 pm
Check for attachments in the email confirmation
6 3 Register!  
 
Training - AS200 i-line stepper training-Part I - Meet in the photolithography bay of the cleanroom.
Trainer: Guixiong Zhong
This is the first part of a two part stepper training. System overview, job making, editing, reticle loading, automatic wafer loading, wafer stepping, and unloading will be covered in the training. Please see the tool webpage for more information on the capabilities of this tool.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:30 am - 12:30 pm
4 4 Register!  
 
Training - Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - LISE-G07 (cleanroom-metrology bay)
Trainer: Jason Tresback
This metrology part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak 6M) (PL-3/5), single wavelength scanning Ellipsometer (Gaertner-LSE) (ES-2), scanning sheet resistance mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:00 am - 12:00 pm
4 3 Register!  
 
Training - RIE-11 PT Diamond RIE - LISE Cleanroom G07 at the tool
Trainer: Ling Xie
1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10°C to180°C. In addition, the temperatures of three other components inside the chamber can also be controlled from room temperature to 180°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.

2. Application
Only Diamond is allowed to be etched in this RIE and all other materials are forbidden.

3. Contacts
For issues related to etching processes, please contact Ling Xie; for issues related to equipment, please contact Steve Paolini and David LaFleur.

Ling Xie: 6-9069 lxie@cns.fas.harvard.edu;
Steve Paolini: 6-9816 spaolini@cns.fas.harvard.edu;
David LaFleur: 5-5024 dlafleur@cns.fas.harvard.edu
  Time Max Attendees Available LISE Cleanroom Users ONLY
  1:30 pm - 3:00 pm
4 1 Register!  
 
Training - SPECTRO XRF Training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Learn to use SPECTRO XRF system, which can do elemental analysis on both solid and liquid samples.
  Time Max Attendees Available CNS Users ONLY
  1:30 pm - 3:00 pm
2 2 Register!  
 
Training - Wetbench + Chemical Safety Training - We meet OUTSIDE G-07 Gowning Area (YES, OUTSIDE, then we go UPSTAIRS)
Trainer: Mac Hathaway
Training for use of the CNS wetbenches, with special emphasis on chemical safety, with some process engineering and other select topics
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:00 am - 12:30 pm
8 6 Register!  
 
Training - XeF2 Etcher training - LISE Cleanroom G07 at the tool
Trainer: Ling Xie
Isotropic etching of Si.
  Time Max Attendees Available CNS Users ONLY
  4:00 pm - 4:30 pm
4 2 Register!  
 
         
 
Thursday, January 29th, 2015
Training - Atomic Force Microscopy Part-2 Individual User Qualification (Asylum MFP3D -AFM) - LISE G12
Trainer: Jason Tresback
This training event is designed to allow individual users to operate the Asylum MFP3d AFM with staff assistance in order to qualify for independent tool use. Users are encouraged to bring their own sample and/or probe tip’s, otherwise they will be provided for training purposes. Full tool access requires attending part-1 basic imaging and operation demonstrated by staff, followed by at least one user assisted session on another day that serves as an individual user qualification. We meet in hallway outside LISE G12
  Time Max Attendees Available CNS Users ONLY
  2:00 pm - 5:00 pm
3 1 Register!  
 
Training - G06 Safety Orientation - G06
Trainer: Jules Gardener
Required for G06 room and tool access
  Time Max Attendees Available CNS Users ONLY
  10:00 am - 10:30 am
6 5 Register!  
 
Training - Introduction To Photolithography (Headway Spinner and Contact Aligner Training) - Photo bay inside the clean room
Trainer: Amehayesus Gebreyohannes
In This training session we will cover wafer cleaning and resist coating, Soft bake, Exposing and developing a Photolithography pattern

Training will cover use the Headway Spinner benches, the MJB4 contact aligner and the Developer Bench, with a focus on positive resist processes.

Prerequisite: Wet bench + chemical Safety training
  Time Max Attendees Available LISE Cleanroom Users ONLY
  2:00 pm - 4:00 pm
4 FULL Registration Closed  
 
Training - LISE Cleanroom orientation - meet in front of G07
Trainer: John Tsakirgis
The orientation of our LISE Clean room, to address our safety, gowning and general protocols.
  Time Max Attendees Available Open Event!
  9:00 am - 10:30 am
Please be prompt ...
5 4 Register!  
 
Training - Matrix plasma asher - clean room
Trainer: David LaFleur
level 1 - writing recipe and running system
  Time Max Attendees Available CNS Users ONLY
  1:30 pm - 2:00 pm
4 3 Register!  
 
Training - RIE-1 SouthBay - LISE Cleanroom G07 at the tool
Trainer: Ling Xie
Equipment

The SouthBay reactive ion etcher is for anisotropic etching. It is a capacitive coupled parallel plate plasma reactor and equipped with 200W RF generator, manual matching network, 6” sample stage, and turbo pump. Available etching gases with this tool include SF6, CF4, CHF3, O2, and Ar.

Applications

It can be used to etch Si, SiO2, Si3N4, W, Ti, and other substrate materials.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  3:00 pm - 4:00 pm
4 2 Register!  
 
Training - RIE-6 Nexx RIE Training - LISE Cleanroom G07 at the tool
Trainer: Ling Xie
NEXX RIE-6 is an ECR (electron cyclotron resonance) RIE system. ECR technology produces high plasma density and low ion energy at low chamber pressure and results in low plasma damage and high etch rate. The system is integrated with a load-lock wafer transfer, allowing fast system pump-down and low base pressure (10-6 to 10-7 Torr). Backside helium cooled chuck allows substrate temperature to be controlled < 120 ºC. The entire system is fully computer controlled. Available gases on this tool include He, Ar, O2, CF4, CHF3, Cl2, CH4, and H2. Except polymer stripping, all other materials’ dry etchings are allowed.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  1:30 pm - 3:00 pm
4 1 Register!  
 
Training - Soft Lithography Training - LISE G06
Trainer: Hao-Yu (Greg) Lin
Training includes UV flood exposure system, KLA-Tencor contact stylus profiler, Headway spin coater, Thinky mixer, Plasma Prep system and Wax printer.
  Time Max Attendees Available CNS Users ONLY
  10:30 am - 12:00 pm
3 1 Register!  
 
         
 
Friday, January 30th, 2015
Training - AS200 i-line stepper training-Part II - Meet in the photolithography bay of the cleanroom.
Trainer: Guixiong Zhong
This is the second part of a two part stepper training. Manual loading, unloading, aligning, and basic overlay strategy will be covered. The prerequisite is AS200 i-line stepper training-Part I.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:30 am - 12:30 pm
4 4 Register!  
 
Training - Basic Confocal Microscopy - LISE G04
Trainer: Arthur McClelland
Learn to use the Olympus FV300 for basic confocal microscopy
  Time Max Attendees Available CNS Users ONLY
  1:30 pm - 3:00 pm
3 2 Register!  
 
Training - JA Woollam Spectroscopic Ellipsometer training - LISE-G07, in the Metrology bay of cleanroom
Trainer: Jiangdong Deng
This training course will go through the basic operation procedures of JA Woollam Spectroscopic Ellipsometer. User is welcome to bring the sample for measurement.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  10:00 am - 12:00 pm
4 4 Register!  
 
Training - Makerbot 3D printer - LISE G06
Trainer: Arthur McClelland
learn to print objects with the Makerbot 3D printer
  Time Max Attendees Available CNS Users ONLY
  10:30 am - 11:30 am
3 1 Register!  
 
Training - Nanofabrication Cleanroom Optical Microscope and Contact Angle Measurement Training (Visible and IR) - LISE-G07 (cleanroom-metrology bay)
Trainer: Jason Tresback
This training event will cover basic operations of the various optical microscopes, digital cameras, and contact angle measurement system available inside the Nanofabrication Cleanroom. There are five independent systems consisting of Nikon L200, Nikon Optiphot 150 and Optiphot 66, and two Olympus BX51s. These are equipped with two Nikon CCD cameras, a Motic camera, an Xfinity 1 CCD camera, and a Q-imaging IR camera. The systems contain 2.5x to 150x objectives, BF/DF modes, reflective/transmission modes, and the Optiphot 150 has a NWL-641 Auto Loader for 4 and 6” wafer cassettes. The FTA135 series contact angle and surface tension measurement system uses video-based software to analyze drop shape without operator error. The manual stage can accommodate up to 200mm wafers and liquid can be dispensed with a fixed volume using syringe pipette.
  Time Max Attendees Available LISE Cleanroom Users ONLY
  2:30 pm - 3:30 pm
4 3 Register!  
 
Training - WiTec advance technique training (NSOM/AFM) - LISE-G12
Trainer: Jiangdong Deng
This training course will cover the advanced techniques of WITEC NSOM/AFM/Raman Microscope system, such as NSOM.AFM,SERS,SEARs. Before taking this training, user are required to finish the WITEC Confocal Raman Training first.
  Time Max Attendees Available CNS Users ONLY
  2:00 pm - 4:00 pm
2 2 Register!  
 
         
 
 

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